Wen-bin Young: search on Z-Library

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1

The thrust and lift of an ornithopter's membrane wings with simple flapping motion

Che-Shu Lin, Chyanbin Hwu, Wen-Bin Young

Journal:

Aerospace Science and Technology

Year:

2006

Language:

english

File:

PDF, 828 KB

english, 2006

2

Experimental and analytical study on filling of nano structures in micro injection molding

Huang-Ya Lin, Ching-Ho Chang, Wen-Bin Young

Journal:

International Communications in Heat and Mass Transfer

Year:

2010

Language:

english

File:

PDF, 1.64 MB

english, 2010

3

Compacting pressure and cure cycle for processing of thick composite laminates

Journal:

Composites Science and Technology

Year:

1995

Language:

english

File:

PDF, 848 KB

english, 1995

4

Analysis of the filling capability to the microstructures in micro-injection molding

Huang-Ya Lin, Wen-Bin Young

Journal:

Applied Mathematical Modelling

Year:

2009

Language:

english

File:

PDF, 647 KB

english, 2009

5

Application of the Underfill Model to Bump Arrangement and Dispensing Process Design

Sin-Wei Peng, Wen-Bin Young

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2010

Language:

english

File:

PDF, 1.05 MB

english, 2010

6

The effect of solder bump pitch on the underfill flow

Wen-Bin Young,, Wen-Lin Yang,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2002

Language:

english

File:

PDF, 633 KB

english, 2002

7

Vacuum effect on the void formation of the molded underfill process in flip chip packaging

Guo, Xue-Ru, Young, Wen-Bin

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 4.30 MB

english, 2015

8

A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder Bumps

Lai, Chyi-Lang, Young, Wen-Bin

Journal:

Journal of Electronic Packaging

Year:

2004

Language:

english

File:

PDF, 708 KB

english, 2004

9

Experimental study of filling behaviors in the underfill encapsulation of a flip-chip

Meng-Fu Shih, Wen-Bin Young

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 6.25 MB

english, 2009

10

Micro-injection molding with the infrared assisted mold heating system

Ming-Ching Yu, Wen-Bin Young, Pe-Ming Hsu

Journal:

Materials Science and Engineering: A

Year:

2007

Language:

english

File:

PDF, 1.62 MB

english, 2007

11

Effect of process parameters on injection compression molding of pickup lens

Journal:

Applied Mathematical Modelling

Year:

2005

Language:

english

File:

PDF, 400 KB

english, 2005

12

Modeling of a non-Newtonian flow between parallel plates in a flip chip encapsulation

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 576 KB

english, 2010

13

Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA

Ching-Ho Chang, Wen-Bin Young

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 766 KB

english, 2011

14

Optimal design of the cure cycle for consolidation of thick composite laminates

Ming-hui Chang, Associate Professor Chieh-li Chen, Associate Professor Wen-Bin Young

Journal:

Polymer Composites

Year:

1996

Language:

english

File:

PDF, 703 KB

english, 1996

15

Three-dimensional nonisothermal mold filling simulations in resin transfer molding

Journal:

Polymer Composites

Year:

1994

Language:

english

File:

PDF, 819 KB

english, 1994

16

Resin flow analysis in the consolidation of multi-directional laminated composites

Journal:

Polymer Composites

Year:

1995

Language:

english

File:

PDF, 721 KB

english, 1995

17

Fabrication of the plastic component for photonic crystal using micro injection molding

Ching-Ho Chang, Wen-Bin Young

Journal:

Microsystem Technologies

Year:

2010

Language:

english

File:

PDF, 396 KB

english, 2010

18

Analysis of capillary flows in non-uniform cross-sectional capillaries

Journal:

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Year:

2004

Language:

english

File:

PDF, 118 KB

english, 2004

19

Structural Analysis and Design of the Composite Wind Turbine Blade

Wen-Hsiang Wu, Wen-Bin Young

Journal:

Applied Composite Materials

Year:

2012

Language:

english

File:

PDF, 651 KB

english, 2012

20

Analysis of the edge effect in resin transfer molding

Wen-Bin Young, Chyi-Lang Lai

Journal:

Composites Part A: Applied Science and Manufacturing

Year:

1997

Language:

english

File:

PDF, 706 KB

english, 1997

21

Effect on Filling Time for a Non-Newtonian Flow During the Underfilling of a Flip Chip

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 627 KB

english, 2011

22

Non-Newtonian Flow Formulation of the Underfill Process in Flip-Chip Packaging

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 464 KB

english, 2011

23

Study on Bump Arrangement to Accelerate the Underfill Flow in Flip-Chip Packaging

Lin, Shih-Wei, Young, Wen-Bin

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 863 KB

english, 2013

24

Underfill viscous flow between parallel plates and solder bumps

Wen-Bin Young,, Wen-Lin Yang,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 510 KB

english, 2002

25

Experimental investigation on blade-stiffened panel with stiffener-to-skin fiber stitching

Chang, Chen-Wen, Young, Wen-Bin

Journal:

Year:

1996

Language:

english

File:

PDF, 519 KB

english, 1996

26

Design of the printing pattern on film for three-dimensional molded interconnect devices

Liu, Ren Hao, Young, Wen-Bin, Ming, Hsu Pe

Journal:

Advances in Polymer Technology

Year:

2017

Language:

english

File:

PDF, 1.30 MB

english, 2017

27

Study on residual stresses of thin-walled injection molding

Tong-Hong Wang, Wen-Bin Young

Journal:

European Polymer Journal

Year:

2005

Language:

english

File:

PDF, 184 KB

english, 2005

28

Capillary impregnation into cylinder banks

Journal:

Journal of Colloid and Interface Science

Year:

2004

Language:

english

File:

PDF, 390 KB

english, 2004

29

Residual stress induced by solidification of thermoviscoelastic melts in the postfilling stage

Journal:

Journal of Materials Processing Technology

Year:

2004

Language:

english

File:

PDF, 289 KB

english, 2004

30

Anisotropic behavior of the capillary action in flip chip underfill

Journal:

Microelectronics Journal

Year:

2003

Language:

english

File:

PDF, 428 KB

english, 2003

31

Model resin permeation of fiber reinforcements after shear deformation

Chyi-Lang Lai, Wen-Bin Young

Journal:

Polymer Composites

Year:

1997

Language:

english

File:

PDF, 598 KB

english, 1997

32

The effects of preforming induced variable permeabilities on the rtm molding flow

Chyi-lang Lai, Wen-bin Young

Journal:

Polymer Composites

Year:

1999

Language:

english

File:

PDF, 1.43 MB

english, 1999

33

Modeling fiber slippage during the preforming process

Chyi-lang Lai, Wen-bin Young

Journal:

Polymer Composites

Year:

1999

Language:

english

File:

PDF, 1021 KB

english, 1999

34

Study of the bending induced gap in fiber preforming of woven fiber mats

Zheng-Sen Gao, Wen-Bin Young

Journal:

Polymer Composites

Year:

2002

Language:

english

File:

PDF, 559 KB

english, 2002

35

Consolidation and cure simulations for laminated composites

Journal:

Polymer Composites

Year:

1996

Language:

english

File:

PDF, 583 KB

english, 1996

36

Analysis of filling distance in cylindrical microfeatures for microinjection molding

Journal:

Applied Mathematical Modelling

Year:

2007

Language:

english

File:

PDF, 225 KB

english, 2007

37

Analysis of the nanoimprint lithography with a viscous model

Journal:

Microelectronic Engineering

Year:

2005

Language:

english

File:

PDF, 428 KB

english, 2005

38

Functional interaction between FOXO3a and ATM regulates DNA damage response

Tsai, Wen-Bin, Chung, Young Min, Takahashi, Yoko, Xu, Zhaohui, Hu, Mickey C-T.

Journal:

Nature Cell Biology

Year:

2009

Language:

english

File:

PDF, 219 KB

english, 2009

39

Functional interaction between FOXO3a and ATM regulates DNA damage response

Tsai, Wen-Bin, Chung, Young Min, Takahashi, Yoko, Xu, Zhaohui, Hu, Mickey C.-T.

Journal:

Nature Cell Biology

Year:

2008

Language:

english

File:

PDF, 3.23 MB

english, 2008

40

FOXO3 signalling links ATM to the p53 apoptotic pathway following DNA damage

Chung, Young Min, Park, See-Hyoung, Tsai, Wen-Bin, Wang, Shih-Ya, Ikeda, Masa-Aki, Berek, Jonathan S., Chen, David J., Hu, Mickey C.-T.

Journal:

Nature Communications

Year:

2012

Language:

english

File:

PDF, 1.32 MB

english, 2012

41

[IEEE 2011 International Conference on Fluid Power and Mechatronics (FPM) - Beijing, China (2011.08.17-2011.08.20)] Proceedings of 2011 International Conference on Fluid Power and Mechatronics - Optimization of the skin thickness distribution in the composite wind turbine blade

Young, Wen-Bin, Wu, Wen-Hsiang

Year:

2011

Language:

english

File:

PDF, 289 KB

english, 2011

42

The effective permeability of the underfill flow domain in flip-chip packaging

Yang, Connie, Young, Wen-Bin

Journal:

Applied Mathematical Modelling

Year:

2013

Language:

english

File:

PDF, 1.29 MB

english, 2013

43

Three-dimensional modeling of the advanced grid stiffened structures in the co-curing process

Journal:

Composites Part A: Applied Science and Manufacturing

Year:

2013

Language:

english

File:

PDF, 1.71 MB

english, 2013

44

Modeling and numerical study of thermal-compression bonding in the packaging process using NCA

Chang, Ching-Ho, Young, Wen-Bin

Journal:

Applied Mathematical Modelling

Year:

2014

Language:

english

File:

PDF, 4.10 MB

english, 2014

45

A Two-layer Model for the Simulation of the VARTM Process with Resin Distribution Layer

Journal:

Applied Composite Materials

Year:

2013

Language:

english

File:

PDF, 734 KB

english, 2013

46

[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - The Effect of Contact Angle and Solder Bump Arrangement on Underfill Process

Year:

2006

Language:

english

File:

PDF, 3.23 MB

english, 2006

47

Erratum: FOXO3 signalling links ATM to the p53 apoptotic pathway following DNA damage

Chung, Young Min, Park, See-Hyoung, Tsai, Wen-Bin, Wang, Shih-Ya, Ikeda, Masa-Aki, Berek, Jonathan S, Chen, David J, Hu, Mickey C-T

Journal:

Nature Communications

Year:

2013

Language:

english

File:

PDF, 241 KB

english, 2013

48

The application of carbon black and printing ink technology in molded interconnect devices

Liu, Ren-Hao, Young, Wen-Bin

Journal:

Journal of Polymer Engineering

Year:

2014

Language:

english

File:

PDF, 3.54 MB

english, 2014

49

Fabrication of T-Shaped Structural Composite through Resin Transfer Molding

Young, Wen-Bin, Chuang, Min-Te

Journal:

Journal of Composite Materials

Year:

1995

Language:

english

File:

PDF, 1.69 MB

english, 1995

50

Application of lattice Boltzmann method in free surface flow simulation of micro injection molding

Chen, Ying-Xuan, Chang, Shing-Cheng, Young, Wen-Bin

Journal:

Computers & Mathematics with Applications

Year:

2018

Language:

english

File:

PDF, 3.08 MB

english, 2018